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300W SMT BGA SOLDERING REFLOW PLATE
₹599.00
Frequently Bought Together
- This item: 300W SMT BGA SOLDERING REFLOW PLATE(₹599.00)
- SOLDER FLUX SOLDER PASTE(₹110.00)
- TS-15 STEEL BEND TWEEZER(₹85.00)
-
- Automatic constant temperature.
- High performance and high power.
- Can also be used for BGA solder ball.
- Can be used to disassemble the LED light bead and FPC board.
- PTC heating plate and heat dissipating aluminium sheet construction.
- 30 seconds will be reach about 250℃ (±10℃) ≈482℉.No thermostat needed.
Electrical Characteristics:
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- Power: 300W, H-003
- Input Voltage: 110/220V,
- AC<5A
- 260°C ± 10%
- Material: Aluminium + PTC
Package Includes:
-
- 1 X Heating Split Plate LED Removal Heating Chip Demolition 300W Aluminium Welding BGA Solder Ball Station Split Plate
- 4 X Base Screw Set
Additional information
| Weight | 70 g |
|---|---|
| Dimensions | 70 × 70 × 15 mm |
| INPUT VOLTAGE | 230v |
by Mohammad Abu Qaif (verified owner)
Nice
by Devasish Dey (verified owner)
Great and easy to use product for smd removal.