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ESP32-C6 Super Mini Development Board

₹399.00

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ESP32-C6 Super Mini Development Board is a high-performance, ultra-compact microcontroller board powered by the Espressif ESP32-C6FH4 RISC-V SoC. Designed specifically for next-generation Internet of Things (IoT) applications, this thumbnail-sized module integrates Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), and IEEE 802.15.4 protocols, supporting Zigbee 3.0 and Thread communication seamlessly. Consequently, it empowers developers to build low-power, interoperable smart home automation devices and wireless sensor nodes with minimal hardware footprint. Furthermore, the onboard USB Type-C interface simplifies programming and power delivery, while castellated holes enable direct surface-mount soldering onto custom carrier PCBs. Therefore, you can effortlessly deploy advanced wireless solutions in space-constrained electronic projects without sacrificing computational capabilities or radio performance.

Key Features:
  • Multi-Protocol Wireless: Integrates 2.4 GHz Wi-Fi 6, Bluetooth 5 (LE), Zigbee 3.0, and Thread for comprehensive IoT connectivity.
  • RISC-V Core Architecture: Powered by a 32-bit single-core RISC-V processor clocked up to 160 MHz alongside a low-power RISC-V core operating up to 20 MHz.
  • Super Mini Form Factor: Features a tiny, breadboard-friendly footprint with castellated edge pads for convenient SMT assembly.
  • Matter Protocol Support: Enables cross-platform interoperability across major smart home ecosystems including Apple HomeKit, Google Home, and Amazon Alexa.
  • USB Type-C Connectivity: Includes an onboard USB-C port for fast firmware flashing, power input, and hardware debugging.
  • Ultra-Low Power Efficiency: Provides advanced sleep modes and power management features, making it ideal for battery-operated remote devices.
Technical Specifications:
  • Microcontroller: ESP32-C6FH4 RISC-V 32-Bit Single-Core Processor
  • Clock Frequency: High-performance core up to 160 MHz, LP core up to 20 MHz
  • SRAM: 512 KB HP SRAM, 16 KB LP SRAM
  • ROM: 320 KB
  • Flash Memory: 4 MB On-Chip SPI Flash
  • Wi-Fi Standards: IEEE 802.11 ax/b/g/n (2.4 GHz Wi-Fi 6)
  • Bluetooth Standards: Bluetooth 5.0 LE / Bluetooth Mesh
  • 802.15.4 Standards: Zigbee 3.0 and Thread / Matter protocol compatible
  • Operating Voltage: 3.3 V DC
  • Input Voltage (USB): 5.0 V DC ±5%
  • Operating Temperature Range: -40 °C to ±85 °C
Mechanical Specifications:
  • PCB Type: High-grade FR4 double-sided printed circuit board with gold-plated finish
  • Connector: USB Type-C Female Port
  • Antenna Type: Onboard Ceramic Chip Antenna / Ceramic RF Component
  • Pad Configuration: Standard 2.54 mm pitch header holes with castellated edge pads
  • Buttons: Reset (RST) and Bootloader (BOOT) tactile switches
Dimensions:
  • Length: ≈ 22.5 mm
  • Width: ≈ 18.0 mm
  • Height: ≈ 4.5 mm (including USB connector)
  • Weight: ≈ 2.2 g
Pinout and Wiring:
  • 5V: 5V power input pin directly connected to the USB power line.
  • 3V3: 3.3V regulated power output line powering the onboard microcontroller and external sensors.
  • GND: System ground connection pin.
  • GPIO0 / GPIO1 (ADC): Analog input pins and General Purpose I/O lines for sensor interfacing.
  • GPIO2 / GPIO3: Digital I/O pins supporting hardware interrupt and PWM signaling.
  • GPIO4 / GPIO5: Configurable digital I/O lines for peripheral attachment.
  • GPIO6 (SDA) / GPIO7 (SCL): Dedicated I2C bus pins for interfacing displays, RTCs, and environmental sensors.
  • GPIO16 (RX) / GPIO17 (TX): Hardware UART communication lines for serial data transfer.
  • GPIO18 (SCK) / GPIO19 (MISO) / GPIO20 (MOSI): High-speed SPI peripheral interface pins.
  • Note: However, always ensure your external digital circuitry operates at 3.3V logic levels to prevent permanent GPIO damage.
Datasheet Reference:
Commonly Used in:
  • Smart Home Gateways: Building Matter, Thread, and Zigbee hub nodes to bridge wireless IoT equipment.
  • Wearable Electronics: Crafting tiny wearable tracking units and miniature health monitoring devices.
  • Wireless Sensor Networks: Deploying low-power remote environmental sensing nodes across agricultural fields or industrial units.
Applications:
  • Matter Smart Home Automation: Controlling smart lighting systems, smart plugs, and motorized shades using unified protocols.
  • Industrial Internet of Things (IIoT): Monitoring factory machinery temperatures and vibration levels over Wi-Fi 6 or mesh radios.
  • Portable Battery Monitors: Logging wireless power metrics with ultra-low power consumption in sleep modes.
Equivalent Models:
  • ESP32-C3 Super Mini: A similar ultra-compact board based on the ESP32-C3 chip, although it lacks Wi-Fi 6, Thread, and Zigbee hardware modules.
  • Seeed Studio XIAO ESP32C6: A compact development board utilizing the ESP32-C6 microcontroller with an identical feature set in a tiny footprint.
  • NodeMCU ESP32-C6 DevKit: A larger form-factor development board featuring the same ESP32-C6 wireless core and additional pin breakouts.
Package Includes:
  • 1 x ESP32-C6 Super Mini Development Board
  • 2 x 8-Pin Male Pin Header Strips (2.54 mm Pitch)
Weight 4 g

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ESP32-C6 Super Mini Development Board

ESP32-C6 Super Mini Development Board

₹399.00
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