Desoldering Wire Wick

De-Soldering Wire Wick is a professional-grade repair tool designed to simplify the removal of excess solder from printed circuit boards and electronic components. This high-quality wick consists of finely braided copper strands that utilize capillary action to draw molten solder away from joints quickly and efficiently. Consequently, it prevents heat damage to sensitive pads and traces by reducing the duration of contact with the soldering iron tip. The braid typically comes pre-coated with a non-corrosive, high-activity rosin flux that cleans the surface while removing the solder. Furthermore, this 30cm length provides a convenient, portable solution for field repairs or small-scale bench work. Therefore, you should keep this essential de-soldering braid in your toolkit to ensure clean, residue-free component removal and rework.

Key Features:

• High-Absorbency Braid: The geometric weave of the copper strands maximizes surface area to pull in large amounts of solder via capillary force.
• Integrated Flux Coating: Pre-applied flux ensures rapid wetting and prevents oxidation of the copper, allowing for faster solder uptake.
• Thermally Conductive: Efficient heat transfer allows the user to work at lower temperatures, which helps protect delicate SMD components from thermal shock.
• Residue-Free Results: Properly used wick leaves behind a clean surface that is ready for the installation of new components without additional scrubbing.
• Oxidation Resistant: The high-purity copper material resists tarnishing, ensuring a long shelf life and consistent performance over time.

Technical Specifications:

• Material Composition: 99.9% Pure Copper Braid
• Flux Type: R-Type (Rosin) Non-corrosive, No-clean
• Thermal Conductivity: ≈ 401 W/m⋅K (Copper base)
• Melting Point: ≥ 1083°C (Copper), though the flux activates at standard soldering temperatures.
• Surface Resistance: ± 10¹¹ Ω (Flux residue, if any, is non-conductive)

Mechanical Specifications:

• Braid Pattern: Fine flat braid for maximum contact area
• Flexibility: High flexibility for reaching tight spots between components
• Spool/Pack Type: Typically supplied in a protective strip or small coil for easy handling.

Dimensions:

• Total Length: 30 cm (approx. 12 inches)
• Braid Width: ≈ 2.0 mm to 2.5 mm (Standard for general-purpose rework)
• Braid Thickness: ≈ 0.5 mm

Pinout and Wiring:

• Application Technique: Place the wick directly over the solder joint you wish to clean.
• Heat Application: Press the heated soldering iron tip onto the braid for 1 to 2 seconds.
• Solder Absorption: Watch for the copper to change color as it absorbs the molten solder, then lift both the iron and the wick simultaneously.
• Note: However, always cut off the used, solder-saturated end of the braid before moving to the next joint to maintain maximum absorbency.

Datasheet Reference:

• Download General De-soldering Braid Technical Guide

Commonly Used in:

• Printed Circuit Board Rework: Removing bridge shorts or clearing through-holes for part replacement.
• SMD Component Removal: Lifting multi-pin ICs by wicking away solder from all pins safely.
• Laboratory Prototyping: Cleaning up pads on prototype boards to reuse them for different components.

Applications:

• Bridge Removal: Clearing accidental solder bridges between fine-pitch pins on Surface Mount Devices.
• Component Salvage: Safely extracting expensive or rare components from scrap boards without damage.
• General Repair: Standard maintenance on consumer electronics, remote controls, and household appliances.

Equivalent Models:

• Goot Wick CP-2015: A popular Japanese-style de-soldering braid with similar width and flux characteristics.
• Chemtronics Soder-Wick: The industry standard for high-speed de-soldering in production environments.
• NTE Electronics No-Clean Wick: A direct alternative however, it specifically targets applications where no flux residue is permitted.

Package Includes:

• 1 x De-Soldering Wire Fast Solder Removal Tool – 30cm