300W SMT BGA SOLDERING REFLOW PLATE

599.00
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Frequently Bought Together

    • Automatic constant temperature.
    • High performance and high power.
    • Can also be used for BGA solder ball.
    • Can be used to disassemble the LED light bead and FPC board.
    • PTC heating plate and heat dissipating aluminium sheet construction.
    • 30 seconds will be reach about 250℃ (±10℃) ≈482℉.No thermostat needed.
Electrical Characteristics:
    • Power: 300W, H-003
    • Input Voltage: 110/220V,
    • AC<5A
    • 260°C ± 10%
    • Material: Aluminium + PTC
Known As:
    • Hot Plate
    • Soldering Reflow Plate
    • Chip Welding Station
    • PTC Heating Plate
    • BGA Solder Ball Station
    • LED Repair Plate
Package Includes:
    • 1 X Heating Split Plate LED Removal Heating Chip Demolition 300W Aluminium Welding BGA Solder Ball Station Split Plate
    • 4 X Base Screw Set

Additional information

Weight 70 g
Dimensions 70 × 70 × 15 mm
INPUT VOLTAGE

230v

Average Rating

5.00

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( 2 Reviews )
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2 Reviews For This Product

  1. 02

    by Mohammad Abu Qaif (verified owner)

    Nice

  2. 02

    by Devasish Dey (verified owner)

    Great and easy to use product for smd removal.

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300W SMT BGA SOLDERING REFLOW PLATE

599.00
You save

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