300W SMT BGA SOLDERING REFLOW PLATE

• • Automatic constant temperature.
  • High performance and high power.
  • Can also be used for BGA solder ball.
  • Can be used to disassemble the LED light bead and FPC board.
  • PTC heating plate and heat dissipating aluminium sheet construction.
  • 30 seconds will be reach about 250℃ (±10℃) ≈482℉.No thermostat needed.

Electrical Characteristics:

• • Power: 300W, H-003
  • Input Voltage: 110/220V,
  • AC<5A
  • 260°C ± 10%
  • Material: Aluminium + PTC

Known As:

• • Hot Plate
  • Soldering Reflow Plate
  • Chip Welding Station
  • PTC Heating Plate
  • BGA Solder Ball Station
  • LED Repair Plate
  • LED Lamp Bead Welding Plate

Package Includes:

• • 1 X Heating Split Plate LED Removal Heating Chip Demolition 300W Aluminium Welding BGA Solder Ball Station Split Plate
  • 4 X Base Screw Set