SILICONE HEAT SINK COMPOUND

Fill the gap between heating element and the cooling device; Increase the contact area, so as to achieve the soundest effect of thermal conductivity.

• • Special properties: stable at higt temperatures
  • Type:Silicone fluid
  • Physical from:Grease-like
  • Thermal conductivity: > 1.05W/m-k
  • Specific Gravity:>2.1g/cm3
  • Working temperature: -50~200 C
  • Color: Grayness

Package Includes:

• • 1 x Silicone Heatsink Compounds Thermal Grease Paste Heat Sink Compound for CPU and Chipsets Graphics Card LED IC