LSM6DS3 Accelerometer Gyro Embedded Digital Temperature Sensor

LSM6DS3 3-Axis Accelerometer + 3-Axis Gyroscope with Embedded Digital Temperature Sensor (LGA-14) delivers high-performance inertial sensing and on-chip temperature measurement in a compact package. Designers integrate it into motion tracking, gesture recognition, and stabilization systems for responsive, low-power sensing.

Key Features:

• 6-axis IMU: Combines 3-axis accelerometer and 3-axis gyroscope on a single die for compact motion sensing.
• Embedded Temperature Sensor: Reports device temperature for compensation and monitoring.
• Multiple ODR and FS Options: Offers selectable output data rates and full-scale ranges to match accuracy and power targets.
• Low Power Modes: Supports power saving with multiple standby and low-power operating modes.
• I²C and SPI Interfaces: Provides flexible digital communication for microcontrollers and SoCs.
• On-Chip FIFO: Buffers sensor data to reduce host interrupts and optimize power and bus usage.
• Interrupts and Event Detection: Supplies programmable INT pins for free-fall, tap, wake-up, and orientation events.

Technical Specifications:

• Supply Voltage (VDD): Typical 1.8–3.6 V (check datasheet for exact limits)
• Accelerometer Full Scales: Selectable ±2, ±4, ±8, ±16 g (user selectable)
• Gyroscope Full Scales: Selectable ±125, ±245, ±500, ±1000, ±2000 dps (verify supported steps)
• Output Data Rates (ODR): Configurable; supports low-rate to high-performance settings (up to several kHz in high-performance modes)
• FIFO Buffer: On-chip FIFO reduces host load and supports burst reads
• Interfaces: I²C (standard/fast modes) and SPI (4-wire) for flexible host connection
• Temperature Sensor: Internal digital temperature output for compensation and monitoring
• Operating Temperature Range: Commercial and industrial options; consult datasheet for exact ranges
• Typical Current Consumption: Ultra-low standby and configurable active currents to balance performance and battery life

Mechanical Specifications:

• Package Type: LGA-14 (land grid array) compact surface-mount package
• Package Material: Molded plastic with solderable NiPdAu or Cu pad finish per supplier variant
• PCB Mounting: Reflow solderable; follow manufacturer recommended land pattern and solder profile
• ESD and Handling: Observe ESD precautions and manufacturer handling guidelines to avoid damage

Dimensions:

• Typical Footprint: Compact 3 mm × 3 mm nominal (verify exact mechanical drawing in datasheet)
• Package Height: Low profile suitable for compact PCBs; see datasheet mechanical tolerances
• Pad Layout: Use the recommended land pattern from the datasheet for best solder reliability and thermal performance

Pinout and Wiring:

• Power Pins: VDD (supply) and GND (ground). Decouple VDD close to the device with recommended capacitors.
• Digital Interface Pins: SDA / SCL for I²C or SDI / SDO / SCK / CS for SPI depending on selected interface mode.
• Interrupt Pins: INT1 and INT2 provide programmable event signaling to the host MCU.
• Wiring Notes: Place pull-ups for I²C lines as recommended. Route critical traces short and use ground plane. Add series gate resistors on SPI lines if needed for signal integrity.
• Configuration: Program sensor registers over I²C/SPI to set ODR, FS, interrupts, and FIFO behavior. Consult application notes for typical register sequences.

Datasheet Reference:

• Download the official LSM6DS3 datasheet from the manufacturer for full electrical characteristics, timing diagrams, register maps, mechanical drawings, and recommended PCB land pattern. Verify exact part marking and revision before production.

Applications:

• Wearables and Fitness Trackers: Capture step count, orientation, and activity with low power consumption.
• Smartphones and Tablets: Provide device orientation, gesture detection, and motion input.
• Drones and Stabilization: Use for attitude sensing, stabilization loops, and inertial navigation assistance.
• Industrial Motion Sensing: Implement vibration monitoring, tilt detection, and machinery health diagnostics.
• Gaming and VR Controllers: Deliver responsive motion tracking for immersive input devices.

Equivalent Models:

• LSM9DS1 (ST): 9-axis variant with magnetometer if magnetometer data is required.
• ICM-20689 / ICM-20948 (TDK InvenSense): Comparable 6/9-axis MEMS families. Validate register map and electrical compatibility before substitution.
• ADIS / ADXL + ADXRS combos (Analog Devices): Consider discrete accelerometer+gyro alternatives for specialized needs.

Package Includes:

• 1 x LSM6DS3 3-axis accelerometer + 3-axis gyroscope with digital temperature sensor (LGA-14)