AQ-620F Soldering Flux

AQ-620F Soldering Flux is a premium, high-activity flux designed specifically to enhance the quality and reliability of your soldering connections across a wide range of electronic and electrical projects. This flux actively cleans metal surfaces by dissolving and removing oxides and other contaminants, ensuring the molten solder can effectively wet the entire joint area. This powerful cleaning action is essential for achieving strong, shiny, and void-free solder joints, dramatically improving conductivity and mechanical integrity. Whether you are performing intricate surface-mount repairs, assembling prototypes, or working on critical high-reliability circuits, relying on AQ-620F flux provides superior solder flow and minimizes bridging, making your soldering process faster and more effective.

Key Features:

• High-Activity Cleaning: Aggressively removes oxidation layers and impurities from component leads and PCB pads, promoting excellent solder wetting.
• Enhanced Solder Flow: Reduces the surface tension of the molten solder, allowing it to spread smoothly and uniformly across the joint.
• Minimal Residue: Formulated to leave behind clean, non-corrosive residues that often do not require post-soldering cleanup (depending on application).
• Wide Application Range: Compatible with various solders, including leaded and lead-free alloys.
• Dispenser Friendly: The viscosity allows for precise application via brush, pen, or syringe dispensing systems.

Technical Specifications:

• Type: High-Activity Rosin or Synthetic No-Clean (Varies by specific blend, typically Type ROL0 or REL0)
• Operating Temperature: ≈ 180°C to 300°C (Depends on solder alloy used)
• Residue Classification: Varies (Often non-conductive, non-corrosive)
• Halide Content: Low or Zero (For non-corrosive performance)

Mechanical Specifications:

• Form: Liquid or Paste (Typically a viscous paste for application control)
• Color: Clear to Amber
• Shelf Life: Typically 6 to 12 months (When stored in a sealed container under cool conditions).

Dimensions:

• Volume: Sold in various sizes (e.g., 10 mL syringe, 50g jar, 100 mL bottle)
• Container Dimensions: Varies by packaging size.
• Weight: Varies by packaging size.

Pinout and Wiring:

• Note: Soldering flux is a chemical preparation, not an electrical component.
• Usage: Apply a thin, even layer directly to the component leads and/or the copper pads immediately before applying heat and solder.

Datasheet Reference:

• Download AQ-620F Material Safety Data Sheet (MSDS)

Commonly Used in:

• Electronics Repair Shops: Essential for reworking damaged components and bridging complex joints.
• PCB Prototyping: Ensuring reliable connections when hand-soldering sensitive components.
• SMD Rework Stations: Applied before hot air soldering to prevent tombstoning and improve joint formation.

Applications:

• BGA and QFP Rework: Providing superior wetting and reducing shorts on fine-pitch components.
• Wire Tinning: Preparing stranded wires for reliable connection to screw terminals or pads.
• Component Desoldering: Applying before desoldering makes the old solder reflow more easily, simplifying removal.

Equivalent Models:

• Rosin Core Solder: Flux is already integrated into the solder wire, but external flux offers better control and higher activity.
• Paste Fluxes (Amtech, Kester): Other common brands offering high-quality, high-viscosity paste fluxes for professional rework.
• Liquid Flux (Alcohol-Based): Used primarily for wave soldering or spray applications, offering lower viscosity.

Package Includes:

• 1 x AQ-620F Soldering Flux (Volume as selected)